TI ADC mismatch calibration
Raw versus calibrated spectrum, channel mismatch, interleave spur suppression, and background calibration trace.
Demo Library
Full demo library for technical due diligence.
The homepage shows selected proof points. This library keeps the broader RF/analog and system-level evidence grouped by domain, so technical customers and investors can inspect depth without overwhelming the first page.
Analog / Modeling
Calibration, RNM/EEnet, passive extraction, PLL, clocking and divider closure.
RNM/EEnet model validation
Raw model, calibrated model, schematic waveform, residual error, and calibration convergence in one view.
Passive EM-to-RLCK closure
EM-like S-parameters overlaid with fitted RLCK model curves and frequency-dependent fitting error.
PLL long-transient phase noise
PSD, offset phase-noise mask, jitter, reference spur, and fractional-spur extraction from waveform data.
PLL module noise budget
Integer-N and Fractional-N output-referred noise from reference, PFD/CP, loop filter, divider, DSM, VCO, and output buffer summed into total L(f).
FOD fractional-divider closure
Shows the divider testbench loop, PSD/phase-noise extraction, TIE distribution, adaptive cancellation history, and residual spur reduction in dBc.
Photonic / Optical Interconnect
Optical links, OPA, photonic compute, Kerr combs, glass interposers and CPO-style closure.
High-speed optical PAM4 link
PAM4 stimulus, TX FFE, optical modulator/channel, PD/TIA, ADC, RX equalization, and link-quality metrics.
OPA beam steering phase calibration
Optical phased-array beam pattern, phase-error sensitivity, calibration convergence, sidelobe control, and pointing error closure.
Photonic matrix multiply error budget
MZI/MRR weight bank error, optical loss, detector noise, thermal drift, calibration residual, and matrix-compute accuracy budget.
RF driver / modulator / PD-TIA link budget
Electrical driver swing, optical modulation depth, photodiode current, TIA noise, bandwidth, jitter, eye proxy, and link margin.
Nonlinear Kerr comb / DWDM demo
Microresonator comb-line power, thermal locking, DWDM scaling, OSNR margin, energy-per-bit, and dual-comb spectroscopy fingerprint.
Glass optical interposer / passive alignment
FAU/lens active coupling versus glass-waveguide bridge, insertion-loss Monte Carlo, yield, thermal drift, assembly time, and bandwidth density.
P1 coherent FMCW LiDAR + SiPh / OPA
Laser chirp linearity, linewidth coherence, OPA scan error, coherent receiver SNR, range/velocity precision, and calibration margin.
P1 AI cluster optical fabric topology
GPU cluster all-reduce traffic, optical switch topology, bisection bandwidth, tail latency, link power, utilization, and failure recovery.
P1 LPO / LRO / CPO serviceability
Linear optics and CPO tradeoffs across eye margin, equalizer training, module power, field replacement risk, and serviceability score.
1.6T / CPO optical interconnect closure
Lane aggregation, optical modulator/channel, PD/TIA behavior, RX equalization, OMA, extinction ratio, SNR, FEC margin, and energy-per-bit closure.
High-Speed IO / Memory
SerDes, UCIe, HBM/GDDR memory PHY, CTLE equalization and camera interface closure.
112G PAM4 ADC-based RX chain
TX FFE, channel, CTLE, ADC samples, and post-ADC DSP decision variables in one view.
448G/lane exploratory SerDes
Forward-looking PAM4/PAM6/PAM8 architecture comparison with ADC-based RX, TX FFE, CTLE, FFE/DFE/MLSE, CDR, FEC waterfall, ADC-bit and channel-loss tradeoffs.
HBM4 PHY + power-integrity closure
HBM4-style DQ eye, lane-group margins, WCK/DQ training, stack thermal/PDN behavior, PVT sensitivity, bandwidth, and energy closure.
GDDR7 memory PHY closure
Discrete high-speed memory PHY view with channel response, lane margin, clock/data training, SI/PI stress, bandwidth, and energy closure.
PCIe 7 / CXL / UCIe interconnect closure
PCIe/CXL/UCIe mode comparison, interposer/package channel, lane timing and voltage margin, clock/data training, SI/PI sensitivity, bandwidth, BER, and energy-per-bit closure.
P0 glass / CoWoS advanced-package closure
Chiplet interposer SI/PI, package thermal map, warpage, yield, cost index, and glass-versus-CoWoS tradeoff exploration.
P0 UCIe on-package memory wall
Compute-to-memory chiplet bandwidth, latency, package channel loss, energy-per-bit, thermal throttling, and throughput-per-watt tradeoff.
224G segmented CTLE equalization
Low/mid/high-frequency equalization branches, segment controls, waveform contribution, and receiver margin exploration.
MIPI camera sensor interface
Lane waveform, timing/voltage margin, lane skew, common-mode behavior, frame-error proxy, and settling-time closure.
RF / Wireless / Radar
RF transceivers, ET PA, WiFi/Bluetooth, radar, mmWave arrays and SATCOM system closure.
RF transceiver full-chain
TX/RX impairment budget with DPD, PA nonlinearity, IQ imbalance, LO leakage, phase noise, EVM, ACLR, and calibration closure.
Envelope tracking PA deep closure
OFDM envelope stimulus, ET/APT/static supply comparison, delay sensitivity, ACLR/EVM, PAE, PA transfer, and thermal budget in one closure view.
WiFi7 / 5G RF FEM system closure
OFDMA/RU allocation, spectrum mask, MIMO beam/null behavior, EVM budget, rate adaptation, high-order QAM, and RF FEM closure.
Bluetooth 6 channel sounding closure
PBR phase-slope extraction, RTT fusion, 2.4GHz coexistence channel map, DBAF/advertiser monitoring, ISO latency, and architecture tradeoff closure.
FMCW radar range-Doppler
Chirp scene generation, beat waveform, range profile, range-Doppler map, detection view, and radar metric closure.
mmWave 4D imaging radar
Range-Doppler map, CFAR detections, azimuth/elevation spectrum, target point cloud, and system closure metrics.
mmWave array transceiver
Beamforming, TX/RX link budget, blocker behavior, scan metrics, EVM, sidelobe, and array-calibration style closure.
P1 sub-THz 6G ISAC front-end
100-300 GHz RF chain, phased-array gain, EVM, phase-noise sensitivity, sensing range resolution, thermal limit, and link margin.
NTN / SATCOM direct-to-device link
LEO Doppler tracking, NTN/D2D constellation, service pass margin, spectrum-mask closure, handover stress, and broadband SATCOM mode coverage.
Quantum / MEMS / Sensors
Quantum control, secure optical links, MEMS readout, ultrasound and fingerprint mixed-signal closure.
Quantum control and readout RF chain
Qubit drive/readout timing, LO/IQ impairments, DAC/ADC noise, cryo LNA gain, resonator response, skew, and fidelity/SNR closure.
Neutral atom quantum control system
Optical tweezer array, AOM/EOM RF channels, Rydberg blockade margin, laser noise, gate-error budget, calibration, and fluorescence readout closure.
P1 Cryo-CMOS quantum control electronics
Cryogenic DAC/PLL/LNA chain, 4K heat load, drive phase noise, readout SNR, calibration time, and qubit-count scaling.
QKD optical link budget
Fiber loss, detector efficiency, dark counts, jitter, QBER, sifted-key trend, and secure-key-rate sensitivity for quantum communication links.
Crypto side-channel and TRNG validation
Power/EM leakage correlation, masking effectiveness, entropy, bias, autocorrelation, and PVT-style TRNG robustness checks.
P2 PQC secure root / side-channel demo
Post-quantum secure boot, Kyber/Dilithium accelerator cost, leakage correlation, masking, TRNG entropy, and fault-injection detection.
MEMS capacitive accelerometer readout
Differential capacitance sensor, AFE/ADC noise, time-domain motion, offset drift, Allan deviation, linearity, and temperature calibration.
MEMS resonator oscillator phase noise
Motional-RLC resonator, sustaining loop, Leeson phase noise, integrated jitter, Q/drive sensitivity, startup AGC, and temperature compensation.
PMUT / CMUT ultrasonic transducer AFE
High-voltage burst drive, transducer ringdown, echo channel, TIA/LNA noise, TOF detection, SNR/range, blanking, and energy tradeoffs.
Fingerprint sensor mixed-signal closure
Pixel capacitance map, excitation and AFE readout, ADC codes, noise budget, algorithm confidence, FAR/FRR, spoof margin, and requirement decomposition.
Power / Automotive / Safety
Power conversion, high-current PDN, automotive PHY, LiDAR AFE, BMS and gate-driver safety closure.
DCDC Buck deep closure
Switching waveform, startup, efficiency map, loop-gain proxy, ripple spectrum, loss breakdown, and thermal closure.
Datacenter >1000A PDN closure
Rack bus, board VRM, package/on-die PDN, target impedance, AI workload load steps, phase current sharing, connector aging, phase-fault ride-through, and thermal closure.
P0 48V rack-to-chip AI power delivery
Rack bus, board converter, package IVR, on-die grid, workload load step, droop, efficiency, thermal rise, and energy-per-token closure.
P2 AI package aging / reliability
Mission-profile stress, thermal cycling, electromigration, dielectric aging, parametric drift, field monitors, and lifetime-risk margin.
Automotive Ethernet PHY electrical-stress/link closure
Vehicle cable waveform, BCI/EMC margin sweep, cable-length eye margin, cold-crank/load-dump supply stress, ground-offset robustness, ESD recovery, and diagnostic closure.
Automotive LiDAR TIA AFE closure
TOF echo waveform, TIA thresholding, range/SNR/false-echo sweep, ambient sunlight stress, and PD/TIA/ADC error budget.
EV BMS monitor AFE safety closure
Battery stack measurement, cell error budget, balancing schedule, open-wire/surge diagnostic matrix, and low-quiescent safety closure.
SiC/GaN motor gate-driver safety closure
Double-pulse gate waveform, DESAT/UVLO protection, switching-energy sweep, dead-time tradeoff, isolation/CMTI margin, and safety diagnostics.